Kristin Werner, a student at Hennepin Technical College in Minneapolis, has been named recipient of the 2018 Richard C. Ryan Packaging Education Scholarship, funded by Dorner.

This $2,000 scholarship is awarded to a student enrolled in a two- or four-year program at any of PMMI’s partner schools. The scholarship was established in honor of Richard Ryan, the former president and CEO of Dorner, who passed away suddenly in September 2012.  Ryan was a member of the PMMI Board of Directors and encouraged lifelong learning. His commitment to education inspired the creation of this memorial scholarship.

Kristen just completed her first year at Hennepin Technical College, where she earned a 4.0 GPA studying Automated Robotics Engineering Technology. Her high academic achievements have earned her distinctions in the Phi Theta Kappa Honor Society and the Hennepin Technical College President’s Academic Honor’s Club.

“My goal is to be someone who can offer solutions to existing or future problems as they relate to packaging and automation,” Werner wrote in her scholarship’s essay. “I know there will be many challenges and opportunities with the upcoming Baby Boomer generation retiring, and I would like to help address some of those challenges and use the opportunities to enrich their lives.”

This candidates for this year’s Ryan Packaging Education Scholarship were particularly strong, but it was Werner’s drive and determination that helped set her apart from others.

“Ms. Werner’s story embodies many of the elements that Rich would have wished us apply during the selection process: resilience, demonstrated need, a desire to learn and a genuine interest in self-improvement,” said Matt Jones, Vice President of Sales and Marketing, Dorner. “We wish Ms. Werner the best as she looks forward to new opportunities in both personal and professional growth.”

Now in its fifth year, the Richard C. Ryan Packaging Education Scholarship is awarded to a student who presents merit in GPA, faculty recommendation and commitment to excellence within the packaging industry. Students applying for the scholarship must meet the following criteria:

• Have a GPA of 3.0 or higher
• Be enrolled in either a two- or four-year school and pursuing an undergraduate degree
• Be majoring in packaging engineering or a related area
• Demonstrate a commitment to excellence in the packaging area
• Be currently enrolled and attending a PMMI partnering school
• Demonstrate extra-curricular involvement, such as athletics
• Have a recommendation from faculty
• Have a financial need